Participation in our conference is free of charge. We have determined appropriate participation fees for scientists who want to present abstracts at our conference.
Our conference is preparing our scientific program under many titles to bring together academic researchers and scientists from all over the world. Stay with us…
At first, please accept my wishes for peace, health, and happiness to you and your families in the new year ahead.
Following a string of requests, the submission deadline for the APLED 2022 special issue has been extended until 15th March 2023. We hope these extra two months will help you complete your manuscripts pertinently.
Once again, we want to say a massive thank you to everyone who has supported the conference so far. Looking forward to receiving from the majority of you manuscripts for the APLED 2022 Special Issue in Radiation Physics and Chemistry.
The new deadline for manuscript submission to SI-APLED2022 is 15th March 2023.
https://www.journals.elsevier.com/radiation-physics-and-chemistry/forthcoming-special-issues/proceedings-of-6th-asia-pacific-conference-on-luminescence-and-electron-spin-resonance-dating-apled-2022
Warmest Wishes
APLED2022
Special Issue Editorial Board
The main aim of the online APLED 2022 conference is bring to ESR and Luminescence scientists from the community together to share their latest research related to the development and application of luminescence and electron spin resonance methods in addition to their application to the solid-state physics, archaeological, geological, geomorphological, and interdisciplinary research fields.
The conference will also provide a networking opportunity for the academic community around the world to interact and discuss the recent advances on the related topics aiming for long-term sharing of knowledge.
The conference intends to encourage students, postgraduate students, specialists, and other early-career researchers together with senior researchers to present their studies and share their novel ideas. The studies presented at the conference will be submitted to one of the special issues of SCIE-indexed journals.